Are you ready to shape the future of thermal and mechanical engineering? In this high-visibility role, you’ll lead multiple dynamic project teams, comprising top-tier mechanical hardware engineers and global development partners to deliver cutting-edge thermal and performance solutions.
This role brings deep domain expertise in thermal and mechanical systems, offering strategic leadership and technical guidance to ensure optimal performance across projects. You will evaluate designs for compliance with engineering standards and drive the adoption of innovative technologies to enhance thermal efficiency and mechanical reliability.
Key Responsibilities:
Leads multiple project teams of other Thermal hardware engineers and internal and outsourced development partners responsible for all stages of thermal development for complex products and platforms, including solution design, validation, tooling and testing.
Manages deliverables, schedules, and costs for multiple ongoing projects, ensuring that resources are appropriately allocated and that goals, objectives, timelines, and budgets are met in accordance with program and organizational roadmaps.
Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development.
Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.
Provides domain-specific expertise and overall thermal leadership and perspective to cross-organization projects, programs, and activities.
Interprets internal/external business challenges and recommends best practices to improve products, processes or services.
Develops and implements parameters and test plans for new and existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.
Interact with mechanical and electrical engineers to develop optimum platform design architecture, new and innovative concept ideas using the latest technologies based on marketing requirement, and review RFQ process and new components.
Collaborates and communicates with management, internal, and outsourced development partners regarding design status, project progress, and issue resolution.
Represents the thermal team for all phases of larger and more-complex development projects.
Drives innovation and integration of new technologies into projects and activities in the thermal design through HW/FW developments.
Drives POC (proof of concept) with HW and FW/SW development to prove the new technologies and implementation to further products
Solves problems in straightforward situations; analyzes possible solutions using technical experience and judgment and precedents.
Provides guidance and mentoring to less experienced staff members.
Education & Experience Recommended
Four-year or Graduate Degree in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or any other related discipline or commensurate work experience or demonstrated competence.
7-10 years of work experience, preferably in engineering design and solutions, implementation across hardware development lifecycle, or a related field.
Knowledge & Skills
Experience with fan, heat pipe, and vapor chamber design
Experience using various thermal interface materials
Experience relating skin temperature, acoustics, and system performance
Using Flotherm, Ansys or other thermal CFD modeling tools
Using CFD and thermal mockups to validate thermal solution.
Designing sheet metal and plastic parts and associated production tooling and processes
3D Modeling
• Ansys Simulation Software
• Computer-Aided Design
• Electromechanics
• Engineering Design Process
• Finite Element Methods
• Injection Molding
• Machining
• Manufacturing Processes
• Mechanical Design
• Mechanical Engineering
• Mechanical Systems
• New Product Development
• Product Design
• Product Lifecycle Management
• Prototyping
• PTC Creo (CAD Suite)
• Sheet Metal
• SolidWorks (CAD)
• Thermal Management
Cross-Org Skills
• Effective Communication
• Results Orientation
• Learning Agility
• Digital Fluency
• Customer Centricity
Impact & Scope
• Impacts function and leads and/or provides expertise to functional project teams and may participate in cross-functional initiatives.
Complexity
• Works on complex problems where analysis of situations or data requires an in-depth evaluation of multiple factors.
Disclaimer
• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.
The pay range for this role is $130,350 to $200,750 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:
HP offers a comprehensive benefits package for this position, including:
Health insurance
Dental insurance
Vision insurance
Long term/short term disability insurance
Employee assistance program
Flexible spending account
Life insurance
Generous time off policies, including;
4-12 weeks fully paid parental leave based on tenure
11 paid holidays
Additional flexible paid vacation and sick leave (US benefits overview)
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.