Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

Come work at Amazon!

The Role:
As Senior RF ATE Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative production test solutions for products developed for Amazon LEO phased array antennas satellites and ground terminals. You will work closely with an internal inter-disciplinary team, and third-party suppliers to develop ATE test programs, bringing up high-volume production, and debugging of Return Material Authorization (RMA) for Amazon LEO custom silicon. You must be responsive, flexible and able to succeed within an open collaborative peer environment. The ideal candidate will have a strong background in RF and Mixed signal ATE test methodologies and Strong analytical skills to optimize test strategies, balancing comprehensive quality validation against test cost and throughput objectives. You’ll be part of the team that creates a chip and system test infrastructure and methodology applicable to transmit and receive communication systems.

Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.


Key job responsibilities
- Write test plans for mm-wave SoCs tested on Teradyne/Advantest equipment.
- Develop ATE test programs for Teradyne Ultraflex testers using IGXL, C#, and firmware.
- Architect high-volume test solutions across DUT firmware and tester software to optimize total test cost.
- Review device specifications, collaborate with the design team to apply design for test principles to ensure product manufacturability.
- Own the optimization, standardization, and improvement of test methodologies to enhance operational efficiency in production, ensure product quality and minimize cost.
- Work with lab bench mm-wave test systems or probe stations to correlate bench and ATE results.
- Actively identify test related readiness, issues, and optimizations throughout the product lifecycle and work towards expedient resolutions.
- Develop and transfer to volume production RF and high-speed digital die probing techniques to improve accuracy of identifying good dice and improve yield.
- Interact with suppliers such as foundries and OSATs to complete engineering programs for wafer test, final test, and qualification.