As a Senior Principal Thermal Engineer, you will focus on the alignment of OCI thermal hardware design with specific experience in Rack Cooling and the data center physical infrastructure. A mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical, Electrical, Thermal, and Software) to develop and set cooling strategies and actual HW setup that are optimized for the entire rack and effectively manage high performance data center infrastructure. You will work with internal and external partners, focusing on delivering the next generation of world class fluid-cooled hardware and data centers. 

Build, conduct thermal simulations, and review thermal simulation models from partners to identify data center risks and improve efficiency. Familiarization with Open Compute Design Specifications. Familiarization with Next Generation Fluid Cooling Solutions and Advanced Thermal Designs. Understanding mechanical design process to work with mechanical design engineers on all engineering development efforts Experience with mechanical validation tests process that may include, Environmental Test Engineering (ETE), Vibration testing & characterization. Familiarity with Electromagnetic Compliance (EMI/EMC) is a plus Experience in negotiating, establishing, and managing relationships with vendors

Career Level - IC5

Requirements & Responsibilities

Collaborate with internal and external partners across the globe to develop platform hardware and data center infrastructure solutions enabling OCI services. Lead thermal design reviews and presentations of concepts topeers, partner teams, and executives. Proficient with thermal modeling tools at component, server, rack, and data center levels Engineering analysis of fluid cooling assembly and fit-up engineering verification of various GPU and switch configurations in respective racks  Experience with sourcing and selection of in-row and in-rack CDU’s for high end / high reliability compute solutions. Lead liquid cooling server/ rack designs to support engineering lab and manufacturing tests  Aware of latest fluid cooling industry road map and key technology suppliers. Understand driving factors for deploying different fluid cooling technologies Experience in design and delivery of direct to chip liquid cooling loops including internal manifolds, cold plates, hoses, and QD’s for high end, high reliability compute systems Establish a good working relationship with outside suppliers to develop high quality components (e.g., heat-sinks, etc.), and manage thermal/liquid cooling vendor selection process Oversee the build and validation test process of prototypes Perform root cause and corrective action analysis as required Interface with internal and external customers to meet product design intent Familiar with fluid cooling end assembly (L10/L11) manufacturing challenges and long-term reliability concerns Work jointly with multidisciplinary teams consisting of both in-house and external partners in the development of Advanced Cooling Solution (ACS) concept prototypes. Engage hardware development organizations to drive concepts to the product roadmap and OCI data center fleet. Collaborate with multifunctional engineering groups to deliver hardware and data center sites aligned with thermal specifications. Collaborate with firmware and controls engineering teams to create robust thermal control and monitoring systems. Conduct design/debug investigations and support failure analysis and resolution activities for platforms and data center infrastructure. Design and create thermal characterization test plans. Collaborate with technicians and industry partners to complete tests. Analyze results to validate compliance with platform and data center infrastructure specifications. Support the high-level thermal design direction and data center strategy for complex systems ranging from advanced computing (HPC, GPU, FPGA Accelerators, etc.) to general purpose compute, storage, network and/or other specialized programs. Create robust, scalable, secure, and extensible thermal architecture solutions that account for current and anticipated industry/competitive needs. Distill and articulate architectural tradeoffs in the thermal space in terms of key metrics such as feasibility, performance, cost, reliability, availability, and schedule. Partner with the platform and data center architects to drive OCI roadmap definitions. Look for opportunities to generate intellectual property to help strengthen OCI’s position as a leader in cloud computing. Drive and influence technology providers and design partners to develop optimal components and solutions to meet the future requirements of the OCI fleet. Partner within the industry and standards bodies to create standards and form factors key to next generation solutions. Collaborate with the hardware development and data center design and construction teams to ensure seamless transition from architecture to implementation.

Minimum Qualifications

·         10+ years cloud scale provider OR related technical engineering experience AND a Bachelor’s Degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering.

o    OR 7+ years related cloud scale provider OR technical engineering experience AND Master’s Degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering.

o    OR 5+ years related cloud scale provider OR technical engineering experience AND Doctorate degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering.

·         Experience and proficiency in Computational Fluid Dynamics (CFD) analysis and Model Based Design (MBD) analysis.

·         Expertise using Cadence Data Center Solution (aka 6SigmaDCX), OR CoolSim, OR TileFlow, OR AutoDesk CFD, OR ANSYS - Icepak, OR Mentor Graphics FloTHERM.

·         Expertise using MATLAB & Simulink, OpenModelica, Dymola