Job Description Insight Global is looking for a Senior or Principal Product Manager that will be working on site in Austin, TX and support a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions. Their mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. They are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc. They are Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, they are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. The purpose of this role is to drive the product strategy and roadmap for their advanced 2.5D/3D microsystems integration platforms, ensuring alignment between engineering execution, market needs, and business objectives. By serving as the bridge between technical teams and customer requirements, you will facilitate cross-functional collaboration and strategic partnerships to enhance product success and industry presence. Responsibilities Own the product strategy and roadmap for their advanced 2.5D/3D microsystems integration platforms, aligning engineering execution with market needs and business objectives. In this role (reporting into the Business Group), you will serve as the bridge between technical teams and customer requirements to drive product success. Author and maintain comprehensive Product Requirements Documents (PRDs) that guide their process development, EDA integration, and packaging engineering teams. You’ll ensure all stakeholders have a clear blueprint so development efforts remain aligned, efficient, and focused on the right priorities. Drive cross-functional collaboration across internal teams—including packaging R&D, process engineering, design automation, and product marketing—to ensure product features and releases are cohesive and aligned with overall strategy. You will be the key interface keeping everyone on the same page and moving toward common goals. Engage closely with customers and industry partners (e.g. leading foundries and advanced packaging providers) to align our capabilities with evolving industry needs. You will represent the company in technical discussions, gather customer feedback, and form strategic partnerships that enhance our microsystems platform and ecosystem presence. Serve as a technical champion for 2.5D/3D integration – leverage your deep understanding of advanced packaging technologies to guide internal decision-making. You’ll act as a liaison in customer design reviews and industry forums, ensuring their solutions address real-world challenges in chiplet-based system design. Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication to drive predictable delivery of platform milestones. You will deliver results in fast-paced, multi-stakeholder engagements by managing dependencies and proactively resolving roadblocks. Create technical documentation and collateral (such as integration guidelines, reference designs, and user guides) that support customer design teams and highlight the unique value of their technologies. You’ll ensure our technical content and training materials enable rapid adoption and success for our ecosystem users. Monitor advanced packaging market trends and competitive developments, providing actionable insights to inform product positioning, feature prioritization, and differentiation. Your awareness of emerging standards and ecosystem shifts will help keep TIE at the forefront of the industry. Champion a culture of accountability and transparency across all product workstreams. You make sure stakeholders are informed, expectations are managed, and commitments are met — fostering trust and a shared sense of mission among teams. Other related functions as assigned. We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/. Skills and Requirements Required Qualifications Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline. Industry Experience: Senior Product Manager: 5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends. Principal Product Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends. Technical Expertise: Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques. You have direct experience developing or managing cutting-edge packaging solutions and understand the nuances of modeling, simulation, and reliability across electrical, thermal, and mechanical domains. Process & EDA Familiarity: Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows. You can effectively interface with process engineers and EDA teams, ensuring packaging solutions integrate smoothly with design and manufacturing workflows. Exceptional communication skills. You know how to simplify the complex, create clear deliverables, and build trust with both technical and business stakeholders. You excel at translating between engineering and market/customer contexts. Startup DNA. You’re energized by ambiguity, act with urgency, and take ownership of outcomes. You thrive in a fast-paced, dynamic environment and aren’t afraid to wear many hats to get the job done. Execution mindset. You have demonstrated experience driving progress across multiple initiatives in a hands-on role, without the need for layers of management. You plan, execute, and deliver—reliably and proactively. Preferred Qualifications Advanced Degree: MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field. Program Leadership: Proven program management chops – you can demonstrate end-to-end ownership of complex programs involving multiple customer or partner stakeholders. You know how to define success metrics, manage interdependencies, and keep teams aligned and motivated even as projects grow in complexity. Vendor/Partner Management: Experience working directly with subcontractors, vendors, or external partners to define clear expectations, manage deliverables, and hold teams accountable to milestones. Industry Background: Prior experience at a leading semiconductor foundry or packaging house is a strong plus, giving you firsthand insight into advanced packaging processes and the broader industry ecosystem.