**Introduction** As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market. **Your role and responsibilities** Overview: Join IBM’s elite product development team driving innovation across IBM Z, POWER Systems, Storage and Quantum. We are seeking a skilled mechanical modeler with a strong background in simulation, design, and hardware validation to support high-performance and high-reliability server solutions. Role Summary: As a Mechanical Modeler, you will design and optimize module and server hardware systems to meet stringent thermal and mechanical requirements. You’ll collaborate across disciplines to ensure designs meet performance, reliability, safety, and manufacturability standards. This role involves simulation, lab testing, and providing actionable insights to guide engineering decisions. Key Responsibilities: * Develop and simulate system-level hardware models using CAD and FEA tools. * Acquire or collaborate to obtain accurate material properties for modeling. * Analyze qualification test data and validate against simulation results. * Prepare detailed technical reports and presentations for stakeholders. * Provide design guidelines for components such as laminates, TIMs, coolers, chips, GPUs, HBMs, and load actuation hardware. * Influence design decisions to ensure robust packaging and system integration. * First-level packaging (chip, laminate, module) and module-to-socket integration. **Required technical and professional expertise** * Master’s/PhD in Mechanical Engineering. * 3+ years of experience in Finite-Element Modeling (FEM). * Proficiency in CAD (SolidWorks preferred) and FEM tools (ANSYS or Abaqus). * Ability to create scripts (APDL, Python) beyond GUI modifications. * Experience in design for manufacturability (DFM). * Hands-on lab experience. * Strong communication, problem-solving, and time management skills. * Ability to work independently and in cross-functional teams. * Familiarity with electronic packaging and heterogeneous integration. **Preferred technical and professional experience** * 5+ years in mechanical modeling. * Experience in static structural FEA (stress, strain, warpage prediction). * Moisture diffusion and swelling simulation expertise. * Knowledge of server/computer architecture. * Experience with lab tools: tensile testers (Instron/MTS), DMA, TMA, TGA. * Applied statistics and DOE knowledge (Minitab, JMP). * Programming experience in Matlab, Python, LabView, or C++. IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.