Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. We have data center locations in the U.S., Europe, Singapore, and Japan, and customers across all industries. At Annapurna Labs USA, we develop and build the next generation of our cloud infrastructure with cutting edge technologies for machine learning, from ASIC Si chip to servers.

The Trainium Manufacturing, Quality and Reliability Team is part of AWS Annapurna Labs focused on Machine Learning products that designs cutting AI platforms for the world’s largest Cloud Services provider. As a Quality & Reliability Engineer you will engage with an experienced cross-disciplinary staff to conceive and design infrastructure technologies. You will work closely with an internal inter-disciplinary team, and outside partners to drive key aspects of product definition, execution and test in manufacturing. A successful candidate will be responsive, flexible and able to succeed within an open collaborative peer environment.

As a quality and reliability engineer in the team, you will work closely with other teams and vendors to ensure that the quality and reliability of our product meet our high standards and the customer requests, from the design stage all the way to the production. This will include conducting risk assessment and qualifying new products and changes in process and materials, preparing the test program and test fixtures for the reliability testing, monitoring and analyzing real-time yield/reliability data and providing feedbacks, leading customer returns analysis activities, driving the teams and vendors for the process/product improvements.

We are seeking a Quality and Reliability Engineer with the focus on PCBA cards and server systems.


Key job responsibilities
1) Development of DFQR and DFT methodologies and BKMs.
2) Leading DFQR and DFT activities during the product design stage.
3) Product quality & reliability validation (QRV) and ongoing quality & reliability monitoring (OQRM).
4) Test program development for the PCBA card reliability test and the test log review.
5) Working with other teams and manufacturing vendors to identify and close the quality and reliability gaps.
6) Q&R engineering of volume manufacturing:
a. continuous improvement of production test coverage, yield monitoring and SPC;
b. DOEs, analysis, risk assessment and disposition of non-conformance events/non-conforming material.
7) RMAs: test log review, failure analysis, disposition, reporting and follow-up.