Senior Semiconductor Process Engineer – Owns and optimizes wafer fabrication process modules from R&D through high-volume manufacturing for analog, high-voltage, CMOS, and SiC power devices.

Job Requirements:

BS/MS/PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related discipline.

5–15+ years of hands-on semiconductor fab experience in at least one core module (e.g., laser, photo, grind/backside, diffusion, RF/analog clutter mitigation).

Proven track record taking processes from development/qualification into high-volume manufacturing.

Experience with thin film processes in a production semiconductor environment.

Experience running structured experiments and statistical analysis (DOE, SPC, yield tracking).

Strong data analysis capability using tools such as JMP or Klarity; experience with Python or R a plus.

Preferred Skills:

Experience with silicon carbide (SiC) processes (implant, activation, thinning, backside metallization, etc.).

Experience qualifying new tools, recipes, and consumables in a fab environment.

Experience with yield enhancement and defect reduction projects across multiple technology nodes.

Experience supporting customer tape-outs and process change notifications (PCN).

Experience working closely with Integration, Device, and Product Engineering on new technology platforms.

Job Responsibilities:

Sustain, develop, and transfer wafer fabrication processes from R&D to high-volume manufacturing for analog/mixed-signal, high-voltage, CMOS, and SiC power devices.

Own one or more process modules end-to-end, including tool health, recipes, process windows, and documentation.

Run DOE, SPC, FMEA, 8D problem-solving, and yield enhancement projects to improve device performance and manufacturability.

Qualify new tools, process recipes, and consumables, including definition of qualification plans and success criteria.

Work daily in the cleanroom with technicians and equipment engineers to monitor, debug, and optimize processes.

Support customer tape-outs, including process checks, data review, and coordination of process change notifications (PCNs).

Collaborate with Integration, Device, and Product Engineering on new technology platforms and process integration schemes.

Drive module-specific ownership according to background, such as:

Laser & Yield Engineer: Laser annealing (excimer, green, IR), laser trimming, defect inspection/metrology, and fab-wide yield analytics.

Clutter Process Engineer: Noise/clutter reduction in RF and analog modules, layout-dependent effects mitigation, guard rings, shielding, and substrate coupling control.

Grind / Backside Process Engineer: Wafer thinning, stress-relief, TSV reveal, backside metallization, damage removal, and thin-wafer/SiC handling.

Photo Process Engineer: 1X stepper and scanner lithography, overlay, CD control, mask data preparation, and advanced reticle strategies.

Diffusion Process Engineer: High-temperature furnace processes, dopant drive-in, well formation, SiC implantation activation, and thermal budget management.

Pay Details: $40.00 to $60.00 per hour

Benefit offerings available for our associates include medical, dental, vision, life insurance, short-term disability, additional voluntary benefits, EAP program, commuter benefits and a 401K plan. Our benefit offerings provide employees the flexibility to choose the type of coverage that meets their individual needs. In addition, our associates may be eligible for paid leave including Paid Sick Leave or any other paid leave required by Federal, State, or local law, as well as Holiday pay where applicable.

Equal Opportunity Employer/Veterans/Disabled

Military connected talent encouraged to apply

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