JOB SUMMARY
Join a highly innovative engineering organization building next‑generation semiconductor capital equipment components and sub-assemblies. As a Principal Systems/Mechanical Engineer, you will analyze, improve, and define subsystem architectures that directly influence system performance, throughput, and reliability for customers at the forefront of semiconductor equipment manufacturing.
We are seeking a highly skilled Principal Systems/Mechanical Engineer to lead the design and integration of complex subsystems used in advanced semiconductor capital equipment. You will architect mechanical, thermal, fluid, and structural solutions that drive system performance and reliability, working closely with customers and cross‑functional teams across the full product lifecycle. This is a high‑impact technical leadership role with significant influence over subsystem architecture, innovation, and customer success.
What will you do?
This role partners with the business unit, world-class customers, engineering centers, operational sites, and strategic suppliers globally to solve complex multidisciplinary design, manufacturing, and supply chain challenges. Specific examples include:
1. Co-Innovation Through Subsystem Architecture & Design
Analyze, refine, architect and design mechanical subsystems including robotics/mechatronics, vacuum and gas delivery, power systems, and precision mechanical assemblies.Develop detailed CAD models and engineering drawings for weldments, sheet metal, machined parts, and assemblies.Analyze, refine, and define system and subsystem interfaces, requirements, and specifications.Develop and maintain interface control documents (ICDs).Lead requirements decomposition and ensure bi-directional traceability.Establish subsystem validation strategies and verification plans.2. Analysis & Verification
Perform structural, thermal, dynamic, and vacuum-related analyses using advanced FEA tools.Lead risk assessments including FMEAs, root cause analysis, and structured problem‑solving.Validate system reliability through load‑path evaluation, stress analysis, fatigue modeling, and environmental considerations.3. Technical Leadership & Cross‑Functional Integration
Lead cross‑functional design reviews and drive subsystem integration, optimization, and design validation.Collaborate with global teams, suppliers, and customers to refine requirements and resolve technical issues.Champion DFX, VAVE, Lean methodologies, and continuous improvement initiatives.Mentor early‑career engineers, elevate technical standards, and influence engineering culture by role modeling key attributes of leadership and ownership.Make high-impact technical decisions that influence product performance and industry competitiveness.Represent engineering in customer engagements and roadmap discussions.4. Lifecycle, Compliance & Supply Chain Support
Support NPI, RFQ processes, qualification testing, and component lifecycle management.Ensure design compliance with global regulatory standards (UL, CE, RoHS, REACH).Develop and maintain robust documentation including BOMs, specifications, test plans, qual plans, and ECOs.Partner with product management, operations, supply chain, and finance to ensure solutions meet cost, reliability, and schedule targets.How will you get here?
Required
Bachelor’s degree in mechanical, systems, or related engineering field.5+ years experience in semiconductor capital equipment or wafer‑fab, advanced packaging environments.Expertise in mechanical design, precision systems engineering, mechatronics, power systems, and fluid/vacuum systems.Proficiency in FEA, CAD, and structural/thermal analysis tools.Strong communication, documentation, and cross‑functional collaboration skills.Demonstrated ability to lead reviews, guide teams, and interface with customers.Ability to travel domestically and internationally up to 30%.Preferred
MS in mechanical or systems engineeringExperience in semiconductor mechanical system designHands‑on prototyping and global supplier engagementWhy Join Us?
Work on cutting‑edge semiconductor capital equipment with major industry leaders.Drive subsystem architecture and innovation in high‑impact technologies.Collaborate with global teams and customers on complex, multidisciplinary challenges.Enjoy opportunities for technical leadership, creativity, and career advancement.Engineer mission‑critical systems that shape the next generation of semiconductor manufacturing platforms.In close partnership with customers, drive complex subsystem optimization end‑to‑end – from concept architecture to validation and production.Collaborate with leading global semiconductor equipment manufacturers.Drive innovation in high-precision, high‑vacuum, and high‑reliability environments.The pay range for this role is $126,100 - $227,000. Job-related, non-discriminatory factors used to determine the actual offered rate include qualifications and experience, geographic location, education, external market data, and consideration of internal equity. The anticipated close date of this job requisition is: May 08, 2026.As part of the total rewards package, this position is eligible for a short-term incentive based on performance. In addition, Jabil offers benefits to enhance your health, wealth, and resilient self. These include medical, dental, and vision insurance plans; paid time off accruing at a rate of 3.07 hours during your first year of employment; 4 weeks of paid parental leave; in 2026, 11 company-paid holidays (9 fixed holidays and 2 optional floating holidays), subject to change yearly; 401(k) retirement plan; and employee stock purchase plan.BE AWARE OF FRAUD: When applying for a job at Jabil you will be contacted via correspondence through our official job portal with a jabil.com e-mail address; direct phone call from a member of the Jabil team; or direct e-mail with a jabil.com e-mail address. Jabil does not request payments for interviews or at any other point during the hiring process. Jabil will not ask for your personal identifying information such as a social security number, birth certificate, financial institution, driver’s license number or passport information over the phone or via e-mail. If you believe you are a victim of identity theft, contact the Federal Bureau of Investigations internet crime hotline (www.ic3.gov), the Federal Trade Commission identity theft hotline (www.identitytheft.gov) and/or your local police department. Any scam job listings should be reported to whatever website it was posted in.
Jabil, including its subsidiaries, is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, national origin, sex, sexual orientation, gender identity, age, disability, genetic information, veteran status, or any other characteristic protected by law.
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