PCB Technical Leader

Your Impact

We are seeking a highly motivated candidate with a strong background in IC Substrate and Printed Circuit Boards (PCB). The ideal candidate should leverage their expertise to partner with Cisco development engineers, commodity teams, and suppliers/partners to develop next-generation IC Substrate and PCB solutions to meet Cisco requirements.

You will partner for assessment and qualification of IC Substrate and PCB suppliers, contribute to the development of the IC Substrate and PCB commodity strategy, participate in the supplier selection process, and participate in supplier technical and process audits as required. As a domain expert, you will lead IC Substrate/PCB failure analysis, containment, corrective actions, and risk assessment - and work with manufacturing and engineering teams to resolve complex technical problems.

Additionally, you work with cross-functional teams, manage vendor relationships, communicate complex ideas effectively, and drive continuous improvement and excellence throughout the product lifecycle.

Who You'll Work With

You'll be part of the Component Quality & Technology (CQT) within the Global Supplier Management (GSM) organization in Cisco’s Supply Chain Organization. CQT is a key hub of technical innovation in Cisco. Members of the organization focus on evaluating and developing new technologies to enable sustained product differentiation. You will be a part of a diverse team that seamlessly blends different levels of expertise in several areas of semiconductor and systems design combining traditional knowledge with groundbreaking data analytics techniques to tackle increasingly sophisticated problems.

You will regularly engage with Cisco Business Units as your partners and customers, Suppliers of the commodity space you are managing and extended Supply Chain functions including Global Supply Management, Product Operations and Global Manufacturing Organization.

Minimum Qualifications

Possess MS degree in Engineering/Chemistry/Material or equivalent, plus 10+ years IC Substrate/ PCB manufacturing experience Solid understanding and direct experience in IC Substrate/PCB design specifications and requirements, qualification, manufacturing fabrication and test, coupled with familiarity of materials (laminates and resins) and reliability knowledge and experience. Competency in failure analysis techniques such as FMEA, 8D/Corrective Action, Fishbone IFD, Cause and Effect Analysis, Design of Experiments (DOE), and risk assessment.

·       Strong problem solving and conflict resolution skills along with customer focus, decision-making, influencing and ability to meet deadlines.

Experienced in managing supplier relationships and implementing corrective actions and rigorous quality control measures to ensure product standards and reliability are consistently met. Familiarity with key areas of the interconnect design including Mechanical Engineering, Manufacturing, Signal Integrity. Lead multiple technical projects and manage day-to-day work while also focusing on long term goals Focused on teamwork and collaboration, participating in and leading cross organizational teams Effective with multi-functional communication and have excellent interpersonal and presentation skills.

 

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