Yorktown Heights, NY, 10598, USA
1 day ago
Packaging Engineer
**Introduction** IBM Quantum is seeking talented engineers to join the quantum hardware design/simulation team at the IBM Thomas J. Watson Research Center in Yorktown Heights, NY. The team focuses on delivering quantum processor and processor-adjacent designs to meet a variety of internal needs, and develops and drives the methodology to make these designs successful. Designs span in scope from exploratory research to production-roadmap quantum processor unit development. **Your role and responsibilities** The successful candidate will join the cross-disciplinary engineering research team focused on developing the next generation of packaging and system-level interconnect for IBM Quantum's quantum processing units. The role will own complex first- and second-level packaging designs from conception through to execution, including physical design, and work closely with stakeholders up and down the stack to refine the end-to-end quantum computing system assembly. Experience with industry-grade laminate and PCB design tools (Cadence Allegro/APD suite, Mentor Expedition PCB, Altium Designer etc.) is required. Experience with simulation of either/both electromagnetic characteristics and thermal characteristics is a strong bonus. Because the role includes collaboration between several diverse and dynamic teams of technical and operations personnel, good communication skills, initiative, and a strong sense of responsibility are key. Responsibilities include: * Physical design of laminates and PCBs. * Conversion of high-level specifications to low-level design details. * Validating laminate/PCB designs for electromagnetic (signal integrity/power integrity) performance. * Validating laminate/PCB designs for thermal performance. * Collaboration with chip design teams and system integration to drive I/O interface definitions. **Required technical and professional expertise** * PCB/laminate layout (using Cadence Allegro/APD, Altium Designer, Siemens Xpedition etc.). * Familiarity with fabrication DFM cycles. * Mechanical/thermal engineering for microelectronics. **Preferred technical and professional experience** * EM simulation. IBM is committed to creating a diverse environment and is proud to be an equal-opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, gender, gender identity or expression, sexual orientation, national origin, caste, genetics, pregnancy, disability, neurodivergence, age, veteran status, or other characteristics. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.
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