Summary: Seeking a Packaging Design Engineer with expertise in semiconductor packaging and substrate design engineering.

Requirements:

BSME, EE, or equivalent with 5+ years in advanced semiconductor package design. Experience with ceramic and organic substrates. Proficiency in Cadence APD+ for package layout and signal routing.

Preferred Skills:

Thermal/mechanical simulations using ANSYS. 3D CAD (SolidWorks or equivalent) for package visualization. Semiconductor assembly processes knowledge.

Responsibilities:

Design and develop semiconductor packages across various form factors. Ensure compliance with military and aerospace standards. Collaborate to ensure design intent through production. Support prototype builds, testing, and qualification efforts.

Pay Details: $140,000.00 to $145,000.00 per year

Equal Opportunity Employer/Veterans/Disabled

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