Introduction

Adhesive bonding remains a key technology for high-precision assemblies across industries such as semiconductor manufacturing, aerospace, optics, and medical devices, despite its challenges related to the complex and often unpredictable thermomechanical behavior. Currently, the lack of detailed understanding and control over curing-induced residual stresses and post-processing deformation, as well as long-term creep (drift) and stress relaxation during operation (which may lead to failure), limits the reliability of bonded joints.    

Your assignment

In this project, you will explore the complex relation between processing conditions (thermal profile, bond thickness) on residual stresses and deformation present in an epoxy-based adhesive layer. To this end, you will combine experimental insights (DMA, DSC, …) with numerical simulations (Comsol). A baseline version of the numerical model, coupling thermal, chemical curing and mechanical behavior, is already developed during previous work. The model requires further calibration on carefully selected experiments and extension such as the inclusion of relaxation (viscoelastic) effects. One of the aims is to use the model to construct processing diagrams that can be used by the project’s partner ASML. This effort will be in close collaboration with the partner (including the possibility of experimental work at ASML).

Your profile

You are a Master (MSc) student in Physics or Mechanical engineering or a related (engineering/technical) discipline.

The following skills are essential for a successful internship:

You have experience with Physical modellingYou are self-propellingYou are solution orientedAnd you are a communicative student with a pro-active approach
 

This is a master thesis (or a master apprentice) internship, starting in January 2026 for 9 to 12 months (32/40 hours per week).
 

Other requirements you need to meet:

You are enrolled at an educational institute for the entire duration of the internship; 

You need to be located in the Netherlands to be able to perform your internship. In case you ‘re currently living/studying outside of the Netherlands, your CV/motivation letter includes the willingness to relocate. 

If you are a non-EU citizen, studying in the Netherlands, your university is willing to sign the documents relevant for doing an internship (i.e., Nuffic agreement). 

This position requires access to controlled technology, as defined in the United States Export Administration Regulations (15 C.F.R. § 730, et seq.). Qualified candidates must be legally authorized to access such controlled technology prior to beginning work. Business demands may require ASML to proceed with candidates who are immediately eligible to access controlled technology.

Inclusion and diversity

ASML is an Equal Opportunity Employer that values and respects the importance of a diverse and inclusive workforce. It is the policy of the company to recruit, hire, train and promote persons in all job titles without regard to race, color, religion, sex, age, national origin, veteran status, disability, sexual orientation, or gender identity. We recognize that inclusion and diversity is a driving force in the success of our company.

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