**Job Description** College Summer Intern Position requiring that the candidate has completed at least one year towards securing a BS Engineering degree at an accredited college. Assist Hardware Engineers in executing technical projects relating to FPGA design, verification, and/or process improvement activities. Duration: May 2026 - August 2026 In this position, you will participate in BAE Systems' nationwide LEAP Internship & Co-op Program, where you will Learn, Engage, Apply, and Progress within the company. The LEAP Program will provide you with the opportunity to work alongside experienced professionals on impactful projects, engage in career development opportunities, and network with our business leaders and the other students in the program. **Required Education, Experience, & Skills** Must have completed at least one year towards securing a BS Engineering degree at an accredited college. **Preferred Education, Experience, & Skills** Hands-on experience working on FPGA related course work and/or previous internships. **Pay Information** Full-Time Salary Range: $46226 - $62418 Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience. Temporary employees generally are not eligible for BAE Systems benefits, but can elect to participate in the 401(k) savings plan. Temporary employees working 20 hours per week are eligible for medical benefits, the employee assistance program, and business travel accident insurance. **FPGA Engineering Intern (Summer 2026)** **118806BR** EEO Career Site Equal Opportunity Employer. Minorities . females . veterans . individuals with disabilities . sexual orientation . gender identity . gender expression