About Samsung Austin Semiconductor
Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At SAS, we are Innovating Today to Power the Devices of Tomorrow. 

Come innovate with us!

Position Summary

Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in the area of wafer bonding and de-bonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross-functional teams to improve bonding techniques. This role must ensure compliance with industry standards and maintains detailed documentation of process parameters and results. The technical aspects of bonding equipment operation will be the primary responsibility and to ensure smooth 24 / 7 wafer bonding operation.

Role and Responsibilities

Equipment Setup and Operation

Prepare and calibrate bonding and debonding equipment according to manufacturer specifications and process requirements

Ensure tool to tool matching across fabs and between tools

Develop and maintain Preventative Maintenance schedules and procedures

Ensure bonding meets device and process output specifications

Successfully transfer and qualify process from development fab to HVM facility

Technical Troubleshooting

Investigate wafer bonding issues, create troubleshooting plans, and apply corrective action plans

Provide clear updates and instructions to users and management regarding ongoing issues and resolutions

Maintain FMEA and manage RPN reduction activity

Equipment and Process Continuous Improvement

Lead development and design experiments to carry out improvements in bonding yield, reliability, cost, and throughput

Collaborate with vendors in evaluation and qualification on new bonding and de-bonding techniques.  

Talent Development

Providing technical support and training to operators and technicians on equipment operation and procedures

Present key technical developments to SAS technical staff and management  

Skills and Qualifications

Required / Strongly Desired Knowledge/Skills:

Knowledge and familiarity with hybrid bonging techniques and equipment

Bachelor’s degree in Engineering or a related technical discipline.

Minimum of 5 years of engineering experience in Fab Equipment management

Minimum of 3 years in experience in wafer bonding and de-bonding equipment

Experience in the semiconductor environment or in high volume advanced manufacturing

Desire to take on technical challenges and shifting priorities in a fast paced cutting edge environment

Able to work with others in a team-oriented culture

Experience with data analysis: able to quickly analyze, summarize, and present data in an easy to understand format

Experience with project management and project prioritization. Ability to define milestones for a project, work in parallel on multiple projects, and balance long term projects with daily sustaining.

Ability to rapidly come up to speed with new computer applications and systems

Able to work for several hours per day in a clean room environment

Desired Knowledge/Skills but not required:

Knowledge and familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling, etc.

Ability to manipulate and interpret equipment sensor data for the purpose of advanced equipment troubleshooting and setting up of controls for equipment sensors

VBA, Python, R, SQL, or other basic programing

The current base salary range for this role is between $70,480- $179,090. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.

Total Rewards
At Samsung SAS, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.

We offer a comprehensive benefits package, including:

Medical, dental, and vision insuranceLife insurance and 401(k) matching with immediate vestingOnsite café(s) and workout facilitiesPaid maternity and paternity leavePaid time off (PTO) + 2 personal holidays and 10 regular holidaysWellness incentives and MORE
 

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at SAS are full-time on-site.

U.S. Export Control Compliance
This role requires access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.

Trade Secrets Notice
 By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.

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* Samsung Electronics America, Inc. and its subsidiaries are committed to employing a diverse workforce, and  provide Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, status as a qualified individual with a disability, or any other characteristic protected by law.