**Summary:** Meta is looking for an experienced ASIC Packaging Engineer, Signal Integrity, and Power Integrity focus for its ASIC packaging team to support the development of custom Silicon for Infrastructure as well as to develop packaging solutions that are optimal for our ASIC roadmap. We are building a competency in Packaging technology to support the development of custom silicon and looking for expertise in hardware development and integration of machine learning clusters, both server and fabric with focus on the impact they can create as part of a world-class engineering team. **Required Skills:** ASIC Package Engineer Responsibilities: 1. Drive chip-package-system co-design optimization for High Performance Computing using 2.5D/3D package technology 2. Lead development and roadmap creation for advanced and disruptive packaging technologies (SMT, solder ball attach, assembly processes) for AI/ML and networking products 3. Influence and align ASIC vendors, foundry, and OSAT partners' roadmaps with Meta ASICs roadmap 4. Perform package design and feasibility studies for AI/ML and networking applications including single-chip, multi-chip, and SiP/module packaging 5. Create and analyze Design of Experiments (DOE) for development and sustaining activities **Minimum Qualifications:** Minimum Qualifications: 6. Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience 7. 12+ years of experience in advanced packaging, including surface mount technology, assembly process development, and manufacturing 8. Demonstrated experience of flip chip, 2.5D, and 3D packaging technologies 9. Proven experience taking products from concept to production, including manufacturing specifications, vendor qualifications, and cost/efficiency improvements 10. Experience with cross-functional collaboration skills with internal teams and external partners (silicon, architecture, system, ASIC design, foundry, OSAT, substrate vendors) 11. Experience in silicon architecture/package/PCB/system co-design to develop optimal solutions **Preferred Qualifications:** Preferred Qualifications: 12. Advanced degree (Master's or PhD) in Materials Science, Mechanical Engineering, or related field 13. 15+ years of experience in advanced packaging assembly processes, including SMT 14. Experience with 2.5D and 3D packaging technologies, including silicon interposers, TSVs, microbumps, and fanout advanced packaging 15. Experience collaborating with ODM, assembly packaging, OSAT, and foundry partners 16. Technical understanding of semiconductor packaging materials, material interactions, SMT processes, PCB design/layout, failure mechanisms, and analytical techniques 17. Familiarity with Finite Element Modeling (FEM) for thermal and thermo-mechanical package behavior 18. Knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI) 19. Understanding of package qualification, reliability methods, and failure analysis **Public Compensation:** $212,000/year to $291,000/year + bonus + equity + benefits **Industry:** Internet **Equal Opportunity:** Meta is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender, gender identity, gender expression, transgender status, sexual stereotypes, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics. We also consider qualified applicants with criminal histories, consistent with applicable federal, state and local law. Meta participates in the E-Verify program in certain locations, as required by law. Please note that Meta may leverage artificial intelligence and machine learning technologies in connection with applications for employment. Meta is committed to providing reasonable accommodations for candidates with disabilities in our recruiting process. If you need any assistance or accommodations due to a disability, please let us know at accommodations-ext@fb.com.