The application window is expected to close on 07/25/2025. 

The job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.  

  

Meet the Team 

Cisco Silicon One is a business organization with a long track record of building complex and high-performance Silicon ASICs. Our silicon devices drive the world’s most complex networks and carry over 90% of IP traffic. We are a highly specialized ASIC team with experts in all aspects of advanced IC package design and heterogeneous system integration. Our substrates use the latest 2.5D fanout technologies for large-scale integration, using the latest signaling and data transfer technologies. 

 

Your Impact 

Cisco SiliconOne ASIC team is looking for an advanced IC package designer to help us develop our next generation silicon and platforms. You will work on cutting-edge FCBGA substrates that push the boundaries on power, speed, and fabrication / assembly technology. You will drive package planning & layout to enable on-time, high-quality manufacturing releases. You will be a proficient learner, you will actively implement new technologies and rules, and you will excel in documenting and communicating critical information to the team.

Collaborate with ASIC and Physical Design teams to evaluate and develop floorplans that result in optimal substrate integrationWork with multi-disciplinary teams (system, thermal, mechanical, connector) to understand needs and to create guidance for package implementationPlan substrate designs, including stackups, materials, and design rules, optimized to meet stringent Signal Integrity and Power Integrity rulesImplement package routing with fabrication/assembly aware approachDesign and build power connectivity structures for high power applicationsDrive designs towards successful, on-time completion while meeting important milestonesContribute to team design reviews with actionable feedback to improve quality, capability, and experience of teammatesNegotiate with external manufacturing partners to specify and build best-in-class packages that meet stringent performance and test criteria

 

Minimum Qualifications: 

Degree in Electrical Engineering, related field, or equivalent experience4+ years in the industry with IC Package or PCB development Fluent in Cadence Allegro Package DesignerStrong communication and documentation skills

Preferred Qualifications: 

Fluent in Orbit IOFluent in Calibre for DRC verificationExperience with 2.5D package design, including wafer level fan-outExperience with very large pin count packages or equivalent PCBsFamiliarity with AutoCADWorking knowledge of Signal and Power Integrity fundamentals

 

Why Cisco? 

At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint. Simply put – we power the future.  

 

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere. 

 

We are Cisco, and our power starts with you.