At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.Must be confident in a technical setting and be able to effectively discuss complex IC and IC packaging related topics with customers and internal stakeholders.   This position requires the candidate to utilize his/her exceptional critical thinking and problem-solving skills to understand system-level requirements and work as a team leader at Cadence to resolve technical problems.A strong understanding of IC EDA tools, IC Packaging design, and/or SIPI methodologies and the semiconductor manufacturing eco-system is required.  Experience using some of these methods in production use is highly preferred.Able to lead complex, technical campaigns across multiple business units and field sales teams.The ability to digest system level block diagrams of existing systems, discuss trade-off decisions and impact, and provide suggestions to make improvements in area’s including integration opportunities, use of advanced IC and packaging technologies, and alternative form factors while considering time to market, cost, risk, thermal, electrical, electromagnetic, and signal integrity performance issues.The ability to foster and grow customer relationships throughout all levels of the customer organization to better connect our solutions with the customer's problems/business challenges and ensure roadmap alignment for long term success.A proven track-record demonstrating the ability to identify and understand customer pain-points and to communicate this to a broad range of technical and non-technical individuals.Able to create and manage customer-level programs, actively tracking progress through customer’s projects and set expectations internally and externally.

 

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