**投遞前請注意：本職缺為「硬體工程（電子電機/機構與熱流）」，若對其他實習職務有興趣者，也歡迎參考投遞其他領域職缺，HP 將保留面試分配的最終決定權**

**為確保面試流程順暢，請於投遞履歷及後續聯絡過程中使用相同的電子郵件地址。送出前請務必核對資料正確性，以避免因資訊錯誤導致無法順利接收面試邀約**

實習介紹：一年期實習 (2026/07/01-2027/06/30)，一週實習 3 天

實習資格：碩士班在校生為優先 (實習期間需為全時學生)，畢業時間 2027 年 7-9 月 (以取得畢業證書為主)；必須能全程「實體」參與及配合實習工作地點 (台北南港)

報名方式：2025/03/16 前完成投遞履歷 (中英文皆可，英文為佳)

面試流程：

2/23-3/16 履歷篩選

3/30(Mon) or 4/2(Thu) 第一階段實體筆試及 HR 面試

4/13-4/30 實習部門實體面試

請詳閱以下各部門職缺資訊與徵才需求，待進入面試流程，會由招募團隊在後續面試關卡中進行團隊配對。

請注意，工作內容依部門而異，實際進入部門仍以公司需求及面試結果而定。

Team Name: Business Personal Systems (BPS) Desktop (DT) Hardware EE Team

To know more about the team: Watch Video

Team Collaboration & Testing Support: Seamlessly collaborate within the FLEX I/O and RPL-R Platforms team, leveraging strong communication to execute platform testing and manage data handling efficiently.

Advanced Issue Analysis: Apply an analytical mindset to master design optimization techniques and conduct thorough root-cause analysis of complex system issues.

Innovation & Process Improvement: Actively contribute to innovation and drive continuous process improvement by participating in platform case studies and offering actionable insights.

Hardware Diagnosis & Problem-Solving: Utilize Electrical/Electronic Engineering fundamentals (e.g., schematics, circuit analysis) and problem-solving skills to accurately diagnose and resolve hardware-related challenges.

Precise Data Acquisition & Reporting: Operate essential lab tools (e.g., oscilloscopes, analyzers) for precise data collection while maintaining clear documentation and reporting standards.

Team Name: Personal Systems Operations (PSO) Product Lifecycle Management (PLM) Product Engineer (PE) team

To know more about the team: Watch Video

Architect Hardware Intelligence: Collaborate directly with Hardware Engineering teams to review product issues, translating their technical insights into structured data and automated case-recall modules.

Master AI & Automation Literacy: Build a future-ready skillset by designing AI/LLM-driven workflows with Python and advanced prompting strategies that turn historical hardware data into actionable engineering solutions.

Develop Core Engineering Logic: Master Modular Case Reasoning, learning how to deconstruct complex hardware failures into reusable patterns that significantly accelerate future product development.

Drive Cross-Functional Impact: Bridge the gap between physical hardware and digital automation, developing the Process Thinking necessary to influence workflows across diverse engineering departments.

Team Name: Hybrid Systems – HP/Poly Video Product

To know more about the team: Watch Video

Strategic R&D Contribution: Actively participate in the thermal engineering team for video products, linking work directly to the corporate initiative, "Innovating to lead the Future of Work."

Domain Expertise Development: Successfully and rapidly acquire specialized thermal management knowledge pertinent to high-performance video products.

Core Educational Background: Possess a major in Mechanical Engineering (ME) or Thermal Engineering, providing a strong foundation for analytical tasks.

CAD/Simulation Tool Proficiency (Preferred): Leverage experience with industry-standard tools like Creo Parametric(Pro/ENGINEER) or other thermal simulation software to contribute immediately to design analysis.

Professional Communication: Demonstrate the ability to effectively communicate technical concepts in English within a global team environment.