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Raio de 25 Quilômetros de Osaka
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Osaka, 27, JP
Dry etching Staff Engineer (Staff Process Engineer)
Osaka, JP
Wafer Bonding Engineer (Sr. Equipment Engineer)
9/2/2025
Osaka, 27, JP
Staff Electrical Engineer
Osaka, JP
Staff Electrical Engineer
8/21/2025
Osaka, 27, JP
Test Engineer 2
Osaka, JP
Test Engineer 2
8/4/2025
Osaka, 27, JP
Integration + Wafer Bonding (Staff Packaging Engineer)
7/30/2025
Osaka, 27, JP
Interpreter (Project Coordinator)
7/26/2025
Osaka, JP
Grinding / Trimming / Taping Engineer (Sr. Equipment Engineer)
7/19/2025
Osaka, 27, JP
Wafer Bonding Engineer (Sr. Equipment Engineer)
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